Systems and methods for providing vibration transduction and radio-frequency communication in proximity to an electrically conductive structure

ABSTRACT

Systems and methods are provided for providing vibration transduction and radio-frequency communication in proximity to an electrically conductive structure. The system may comprise an antenna element, an electrically conductive structure in proximity to the antenna element, and a vibration transducer comprising a material. The material may comprise a ferromagnetic material with piezoelectric properties. The vibration transducer may be positioned between the antenna element and the conductive structure.

TECHNICAL FIELD

The present disclosure provides systems and methods for providingvibration transduction and radio-frequency communication. In particular,in some embodiments, the vibration transduction and radio-frequencycommunication may be effectuated in proximity to an electricallyconductive structure.

BACKGROUND

The continued miniaturization of electronic devices requires productdesigners to contend with increasingly demanding design constraints anddesign requirements. Devices are expected to take up less room whileproviding more functionality. More functionality, however, typicallyrequires more components in the devices, making fulfillment of sizerequirements more difficult.

One feature that may be desired in electronic devices is radio-frequency(RF) communication. Devices capable of RF communication generally haveantennas or similar components for transmitting and/or receivingelectric, magnetic, and/or electromagnetic signals. In a small device,one or more antennas may need to be positioned near, or in proximity to,one or more electrically conductive structures. Such structures may bepower or ground planes on a printed circuit board or a metallic layersor chassis to provide structural support to the device (e.g., rigidity).The conductive structure may be a substantially flat surface.Positioning conductive structures near antennas, however, may interferewith the ability of the antenna to transmit and/or receive RF signals.

Another functionality that may be desired in electronic devices is toprovide user-perceived output signals (e.g., haptic and/or auditoryoutputs) to a device user. Similarly, the ability to receive tactile orauditory input (e.g., a button press or a voice command) is anotherfunctionality that may be desired in an electronic device. Includingcomponents to provide these capabilities in a device, however, mayrequire increasing the size of the device. For example, a button forpress inputs or a speaker for auditory output may take up significantsurface area and volume in a device.

In view of the shortcomings of current systems and methods for providingvibration transduction and radio-frequency communication in proximity toan electrically conductive structure, improved systems and methods forproviding the same are desired.

SUMMARY

Consistent with disclosed embodiments, a system providing vibrationtransduction and radio-frequency communication in proximity to anelectrically conductive structure may comprise an antenna element; anelectrically conductive structure in proximity to the antenna element;and a vibration transducer comprising a first material, the firstmaterial comprising a ferromagnetic material with piezoelectricproperties, wherein the vibration transducer may be positioned betweenthe antenna element and the conductive structure.

Consistent with disclosed embodiments, a system providing vibrationtransduction and radio-frequency communication in proximity to anelectrically conductive structure may comprise an antenna elementcomprising an inductor; an electrically conductive structure inproximity to the inductor; and a vibration transducer comprising aferromagnetic material with piezoelectric properties, wherein thevibration transducer may be positioned adjacent to the inductor andbetween the inductor and the conductive structure.

Consistent with disclosed embodiments, a system providing vibrationtransduction and radio-frequency communication in proximity to anelectrically conductive structure may comprise an antenna element; anelectrically conductive structure in proximity to the antenna element;and a vibration transducer comprising a ferromagnetic material withpiezoelectric properties, wherein the vibration transducer may bepositioned between the inductor and the conductive structure, thevibration transducer provides at least one of haptic or auditory outputsignals, and the vibration transducer converts at least one of a tactileor auditory input into an electrical signal.

Consistent with disclosed embodiments, a method for usingradio-frequency communication to initiate vibration transduction inproximity to an electrically conductive structure may comprisetransmitting a radio-frequency signal to an antenna element that is inproximity to an electrically conductive structure within a system andinitiating, with the radio-frequency signal, vibration transduction by avibration transducer positioned between the antenna element and theconductive structure, the vibration transducer comprising a firstmaterial that comprises a ferromagnetic material with piezoelectricproperties.

Consistent with disclosed embodiments, a method for usingradio-frequency communication to initiate vibration transduction inproximity to an electrically conductive structure may comprisetransmitting a radio-frequency signal to an antenna element comprisingan inductor, the inductor being in proximity to an electricallyconductive structure within a system, and initiating, with theradio-frequency signal, vibration transduction by a vibration transduceradjacent to the inductor and between the inductor and the conductivestructure, the vibration transducer comprising a ferromagnetic materialwith piezoelectric properties.

Consistent with disclosed embodiments, a method for usingradio-frequency communication to initiate vibration transduction inproximity to an electrically conductive structure may comprisetransmitting a radio-frequency signal to an antenna element that is inproximity to an electrically conductive structure within a system, andinitiating, with the radio-frequency signal, vibration transduction by avibration transducer comprising a ferromagnetic material withpiezoelectric properties, wherein the vibration transducer is positionedbetween the antenna and the conductive structure, the vibrationtransducer provides at least one of haptic or auditory output signals,and the vibration transducer converts at least one of a tactile orauditory input into an electrical signal.

The foregoing general description and the following detailed descriptionare exemplary and explanatory only and are not restrictive of theclaims.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are incorporated in and constitute apart of this specification, illustrate several embodiments and, togetherwith the description, serve to explain the disclosed principles. In thedrawings:

FIG. 1 is a diagram of a system environment within which an exemplarysystem for providing vibration transduction and radio-frequencycommunication in proximity to an electrically conductive structure mayoperate;

FIG. 2 is a diagram of an exemplary computing system configuration thatmay, in some embodiments, implement the system of FIG. 1; and

FIGS. 3-9 are exploded-view diagrams of the system of FIG. 1.

DESCRIPTION OF THE EMBODIMENTS

As described in further detail herein, the disclosed embodiments aredirected to systems and methods for providing vibration transduction andradio-frequency communication in proximity to an electrically conductivestructure. In this context, transduction may be defined as theconversion of energy or a signal from one form to another. Vibrationtransduction may involve generating a user-perceived output signaland/or receiving physical and voice-command inputs from a user.

In some embodiments, the vibration transduction and radio-frequencycommunication may be provided within a small, portable user device, suchas, for example, a mobile phone, an MP3 player, a portable personalcomputer, an identification device, a payment device, a digital watch, afitness-tracking device, or another type of device. The device may becapable of receiving voice commands and of transmitting and/or receivingRF signals from other devices, providing haptic or auditory notificationto a device user, and/or receiving tactile input from the user (e.g., abutton press, a switch activation, or a touch input).

A user device may comprise an electrically conductive structure inproximity to an antenna or an antenna element within or exterior to thedevice. For example, the conductive structure may be within 5 or 10millimeters of an antenna element. The conductive structure may be ametal plate, metal chassis, ground plane on a printed circuit board, orpower plane on a printed circuit board.

To prevent the conductive structure from interfering with transmissionand reception by the antenna, a ferromagnetic material may be positionedbetween the antenna and the conductive structure. Such material may be aferromagnetic material with piezoelectric properties, which may bothprevent interference and provide user-perceivable output capabilities.Using a single component for these two functions may require less areaor volume in the device than using multiple components.

Reference will now be made in detail to exemplary embodiments, examplesof which are illustrated in the accompanying drawings and disclosedherein. Wherever convenient, the same reference numbers will be usedthroughout the drawings to refer to the same or like parts.

FIG. 1 is a diagram of an exemplary system environment 100 within whichan exemplary user device 102 may operate. User device 102 may providevibration transduction and radio-frequency communication in proximity toan electrically conductive structure, and may be, for example, a mobilephone, an MP3 player, a portable personal computer, an identificationdevice, a payment device, a digital watch, a fitness tracking device,another type of device, or a combination of these devices.

User device 102 may be capable of communicating with another devicesimilar to user device 102 or another type of device. For example, userdevice 102 may communicate with an external smartphone 104, a server106, or other computing system. Inter-device communication may beeffectuated using Radio-frequency Identification (RFID), Bluetooth,Near-Field Communication (NFC), WiFi Direct, or other communicationtechnologies. Another device may initiate vibration transduction in userdevice 102 by transmitting a signal that causes user device 102 togenerate one or more electrical output signals that are transduced intohaptic or auditory output signals.

User device 102 may include technologies, such as various hardware andsoftware components, to transmit and receive RF signals. In the case ofa mobile phone, user device 102 may transmit voice or other data tonearby cell towers. In the case of an MP3 player, user device 102 mayreceive MP3 files from a user's personal computer. In the case of apayment device, user device 102 may transmit or receive paymentinformation to another payment device. In the case of a digital watch,user device 102 may receive time zone information from a user's mobilephone with Global Position System capabilities.

User device 102 may be able to transmit or receive data over network108. Network 108 may be implemented as, for example, the Internet, awired Wide Area Network (WAN), a wired Local Area Network (LAN), awireless LAN (e.g., Institute of Electrical and Electronics Engineers(IEEE) 802.11, Bluetooth, etc.), a wireless WAN (e.g., WorldwideInteroperability for Microwave Access (WiMAX)), a public switchedtelephone network (PSTN), an Integrated Services Digital Network (ISDN),an infrared (IR) link, a radio link, such as a Universal MobileTelecommunications System (UMTS), Global System for MobileCommunications (GSM), Code Division Multiple Access (CDMA), broadcastradio network, cable television network, a satellite link, or the like.Network 108, in some embodiments, may comprise a plurality ofinterconnected wired or wireless data networks that receive data fromone device (e.g., user device 102) and send it to another device (e.g.,smartphone 104).

User device 102 may provide notifications and alerts and may receiveinputs to allow a user to interact with user device 102. For example, auser may turn user device 102 on or off by applying pressure to it or byissuing voice commands to user device 102. In some embodiments, a usermay use another device, such as smartphone 104, to interact with userdevice 102.

In some embodiments, a user may choose an authentication process forusing user device 102. For example, a user may select a multiple-layerauthentication process, such as biometric-data authentication, in-personauthentication, personal identification number, mobile-deviceidentification, and/or credit- or debit-card swipe to gain access to anduse user device 102.

Components in system environment 100 may communicate bi-directionallywith other components in system environment 100 either through network108 or through one or more direct communication links, such as awireless communication link 110 between user device 102 and smartphone104. In some embodiments, wireless communication link 110 may include adirect communication network, including, for example, Bluetooth, Wi-Fi,NFC, or other suitable communication methods that provide a medium fortransmitting data between separate devices.

For ease of discussion, FIG. 1 depicts only particular components beingconnected to network 108. In some embodiments, however, more or fewercomponents may be connected to network 108.

FIG. 2 is a diagram of an exemplary computing system configuration 200that may, in some embodiments, implement user device 102 described abovewith respect to FIG. 1. In some embodiments, computing system 200 mayinclude one or more processors 210, one or more I/O components 220, andone or more memories 230. Computing system 200 may be standalone, or maybe part of a subsystem, which may be part of a larger system. Computingsystem 200 may include an internal database 270 and/or be incommunication with an external database 280.

Processor 210 may constitute a single-core or multiple-core (e.g., dualor quad core) processor that may execute parallel processessimultaneously. For example, processor 210 may be configured withvirtual processing technologies such as logical processors or otherknown technologies to simultaneously execute, control, run, manipulate,store, etc., multiple software processes, applications, programs, etc.One of ordinary skill in the art would understand that other types ofprocessor arrangements could be implemented that provide for thecapabilities disclosed herein. In some embodiments, processor 210 may bea microcontroller.

I/O components 220 may provide interfaces to one or more input devices,such as keyboards, mouse devices, and the like, which may enablecomputing system 200 to receive input from an operator of user device102. I/O components 220 may comprise touch sensors, dome switches, orpiezoelectric sensors. I/O components 220 may further include one ormore displays, such as individual LEDs, LED arrays, liquid crystaldisplays, dot matrix displays, or other types of displays. I/O devices220 may also comprise one or more communication devices 290 configuredto receive and/or transmit data at and from computing system 200.Communication devices 290 may include one or more digital and/or analogcommunication devices that allow computing system 200 to communicatewith other machines and devices, such as other components of systemenvironment 100 shown in FIG. 1. For example, in some embodiments,communication devices 290 may comprise network adapters providingcommunication with network 108 (FIG. 1). In some embodiments,communication devices 290 may comprise wireless communication devicesproviding a direct communication link 110 (FIG. 1).

In some embodiments, communication devices 290 may be configured toreceive user preferences 250 from smartphone 104, and real-timeinformation from smartphone 104 and/or server 106 (FIG. 1). In someembodiments, such real-time information may include location informationof smartphone 104, weather information, traffic information, map data,social-networking data, crime reports, news, air-traffic-control data,police data, medical-emergency data, and fire-service data. In someembodiments, real-time information may also include data captured by asensor on smartphone 104, such as images, video, biometricauthentication data (for example, finger print scan data and facial scandata), temperature data, speed data, and wind speed data. I/O device 220may permit this real-time information to be captured on user device 102using, for example, one or more sensors.

Memory 230 may include one or more storage devices configured to storesoftware instructions 240, which, when executed by processor 210, causeprocessor 210 to perform operations consistent with the disclosedembodiments. The disclosed embodiments are not limited to separateprograms or computers configured to perform dedicated tasks. Processor210 may execute one or more instructions located remotely from computingsystem 200. For example, processor 210 may further execute one or moreinstructions located in database 270 and/or 280 or a cloud server (e.g.,server 106 in FIG. 1) located outside of computing system 200. Theinstructions may comprise server applications, an authenticationapplication, network communication processes, and other types ofapplication or software. Memory 230 may be a volatile or non-volatile,magnetic, semiconductor, tape, optical, removable, non-removable, orother type of storage device or tangible (i.e., non-transitory)computer-readable medium.

Processor 210 may execute instructions 240 to analyze user preferences250 and user data 260 to perform operations consistent with disclosedembodiments. User preferences 250 may be entered by the user. Userpreferences 250 may include information related to logistics of theoperation of user device 102, such as auto-shutdown settings andvibration intensity. Memory 230 may also include user data 260. Userdata 260 may include a user's MP3 files, photographs, financial accountinformation, username and password, home or work locations, credit ordebit card PIN, biometric information, credit scores, financialtransaction history, retail transaction history, user location data forpast financial or retail transactions, financial-data breach alerts,birthdate, or fitness-tracking data. In some embodiments, computingsystem 200 may receive data from server 106 via network 108 (FIG. 1),and store the data in memory 260 as user data 260. In some embodiments,computing system 200 may create one or more user profiles including userpreferences 250 and user data 260, and store the user profiles in memory230, internal database 270, or external database one or more 280.

FIG. 3 is an exploded-view diagram of an exemplary user device 102. Userdevice 102 may comprise a top protective component 301, an antenna 304,a vibration transducer 305, a circuit board such as a printed circuitboard (PCB) 314, a metal plate 317, and a bottom protective component318. Each of these components is discussed in detail below.

Protective components 301, 318 may be a coating or material to protectcomponents within user device 102. Protective components 301, 318 may bea scratch-resistant coating or a material with a scratch-resistantchemical coating, such as ultra-violet curable chemical coating. Thescratch-resistant material may comprise mineral glass, sapphire glass,PVC, PET, BOPET, polyvinylidene fluoride (e.g., Kynar), polyvinylidenedifluoride, PC, PET-G, PMMA, ITO, ZnO, and/or thin-film alloys.Protective components 301, 318 may be plates, covers, or other rigidstructures. In some embodiments, at least one of protective components301, 318 may have an outwardly facing magnetic stripe (not shown) thatmay be read using a magnetic-stripe reader. The magnetic stripe maystore data, such as alphanumeric characters and symbols, in tracks. Dataon the tracks may be read, written, and rewritten. Processor 210 (FIG.2) may route data to and from the tracks.

PCB 314 may contain and/or interconnect electronic components withinuser device 102 such as processor 210, I/O 230, and memory 230 (FIG. 2),as well as other electronic and electrical components such as LEDs andcapacitors. PCB 314 may be a rigid PCB, a flexible PCB, or a combinationof a rigid PCB and flexible PCB. One or more sides of PCB 314 maycomprise an electrically conductive structure such as a power plane or aground plane. The power or ground plane may be formed as internal layersof PCB 314.

FIG. 3 illustrates PCB 314 with a ground plane 315 on its top side.Ground plane 315 may be a layer of conductive material that serves as areturn path for current from components in user device 102. Ground plane315 may cover a large portion of the surface of PCB 314. PCB 314 mayhave a “via”, that is, an opening, 316 in ground plane 315 to permitconnection of a positive lead from antenna 304 to a signal trace on PCB314. In some embodiments, additional vias may be used to permitconnection of conductive paths on PCB 314 to antenna 304 and vibrationtransducer 305. Instead of in addition to PCB 314, user device 102 maycomprise a solid-state circuit. The solid-state circuit may comprise aplurality of components, wherein at least one component may be coupledto vibration transducer 305 and the same or another component may becoupled to antenna 304.

Metal plate 317 may provide structural support (e.g., rigidity) to userdevice 102 or components therein. For example, metal plate 317 mayprovide support to PCB 314. Metal plate 317 may provide rigidity toprevent a user from accidentally breaking user device 102 by, forexample, snapping it. Further, metal plate 317 may provide additionalweight to user device 102 to enhance of quality and help users notice ifuser device 102 falls out of their pockets or is slipping out of theirhands.

Antenna 304 may comprise a single antenna element, a multi-element arrayof antenna elements, or a plurality of separate antennas. Antenna 304may be an NFC antenna, Bluetooth antenna, or other type of antenna, andmay comprise an inductor. Antenna 304 may generate magnetic fieldsand/or emit electromagnetic waves to transmit data. The magnetic fieldsand/or electromagnetic waves may be received by an antenna in anotherdevice and transduced into an electrical signal that may be analyzed bycomponents in the other device to process the transmitted data.

As illustrated in FIG. 3, antenna 304 may be placed in proximity to oneor more internal conductive structures, such as ground plane 315 andmetal plate 317. In some embodiments, conductive structures may beexternal to user device 102.

Magnetic fields generated by antenna 304 may reach ground plane 315 orother conductive structures internal or external to user device 102.When the generated magnetic field changes (e.g., when the transmittedsignal is produced by a changing current to and/or voltage at antenna's304 positive lead), magnetic flux through ground plane 315 changes andcreates eddy currents in ground plane 315, as dictated by Faraday's Lawof Induction. These eddy currents in turn may create a magnetic fieldthat, under Lenz's Law, is in the opposite direction of the magneticfield generated by antenna 304. In this situation, the opposing magneticfield may interfere with the magnetic field from antenna 304 and inhibitthe ability of antenna 304 to transmit a signal to a receiving device.

A similar issue is present when antenna 304 is receiving a magneticfield incident upon it. That is, eddy currents in ground plane 315 emita magnetic field in the opposite direction and interfere with theincident magnetic field, preventing antenna 304 from receiving a desiredsignal without interference. Even if ground plane 315 does not create aninterfering magnetic field (e.g., if there is no ground plane 315),another conductive structure may do so. For example, metal plate 317 mayalso create an interfering magnetic field when subjected to a changingmagnetic field from antenna 304 or another device.

Another problem associated with placing antenna 304 near ground plane315 or another conductive structure is a reduction of inductance ofantenna 304. This reduction may cause the internal impedance of antenna304 to drop and create a mismatch between its impedance and the outputimpedance of the circuit providing the signal to antenna 304, loweringthe power outputted by antenna 304.

To prevent a loss of inductance and to decrease the magnitude of eddycurrents and, consequently, an interfering magnetic field from groundplane 315 or another conductive structure, a ferromagnetic or otherhigh-permeability material, such as a vibration transducer 305, may beplaced between antenna 304 and ground plane 315 or the other conductivestructure to shield the conductive structure from the magnetic fields.Vibration transducer 305 may be a monolithic film and may comprise amaterial with piezoelectric properties, such as polyvinylidenedifluoride (PVDF) or a copolymer of PVDF.

In FIG. 3, vibration transducer 305 is positioned between antenna 304and ground plane 315. Vibration transducer 305 is also positionedbetween antenna 304 and metal plate 317. Vibration transducer 305 mayhave one or more openings 306, 308 to permit connection of leads ofantenna 304 to PCB 314.

FIG. 4 is similar to FIG. 3, and shows a magnetic field 402 (illustratedas magnetic field lines) generated by antenna 304. Since vibrationtransducer 305 is positioned between antenna 304 and ground plane 315 aswell as between antenna 304 and metal plate 317, vibration transducer305 shields ground plane 315 and metal plate 317 from magnetic field304, preventing generation of eddy currents in ground plane 315 and theresultant interfering magnetic fields.

FIG. 5 is another exploded-view diagram of an exemplary user device 102.Vibration transducer 305 may comprise one or more electricallyconductive electrodes 502, 504. Electrodes 502, 504 may be made of ametalized material that is neither piezoelectric nor ferromagnetic. Insome embodiments, electrodes 502, 504 may be positioned on the bottomside of vibration transducer 305. In other embodiments, electrodes 502,504 may be positioned on the top side of vibration transducer 305instead or in addition to the bottom side. For example, electrode 502may be on the bottom side of vibration transducer 305 and electrode 504may be on the top side. One of electrodes 502 or 504 may be directlyabove or below the other electrode, or on another region of vibrationtransducer 305.

Electrodes 502 and 504 may be connected by a conducting material tosignal traces or planes 315 on PCB 314. For example, electrode 502 maybe connected to ground plane 315 and held at a substantially constantvoltage (e.g., 0 V); that is, electrode 502 may be a constant-voltageelectrode. Electrode 504 is connected to PCB 314 and receives electricalsignals to establish an electric potential between electrodes 502, 504,and is designated a “hot” electrode. Since vibration transducer 305 isformed of piezoelectric material, the portion of vibration transducer305 between electrodes 502, 504 is subjected to mechanical stress anddeformed. This deformation may take the form of rapid rising and fallingof the piezoelectric material between electrodes 502, 504, thus creatingan oscillation or vibration. Such vibration may be used to provide auser with a haptic output notification. In some embodiments, vibrationof piezoelectric material between electrodes 502, 504 may generateaudible output signals, such that vibration transducer 305 functions asa speaker.

In some embodiments, a user may apply pressure to the region ofvibration transducer 305 between electrodes 502, 504, thus generating anelectrical signal that travels from electrode 504 to PCB 314. Thissignal may thus constitute a user-input signal to, for example, select afile or enable/disable user device 102. In some embodiments, thepressure may be provided by a finger press. In other embodiments,pressure may be provided as air pressure generated by, for example, avoice input, such that vibration transducer 305 functions as amicrophone.

FIG. 6 is similar to FIGS. 3-5 and shows an electrode 606 configured asa constant-voltage electrode connected to ground plane 315. FIG. 6 alsoshows electrodes 502, 504 both configured as hot electrodes. In anembodiment, one of electrodes 502, 504 is configured to operate as onlyan input electrode and the other of electrodes 502, 504 configured as anoutput electrode.

In an embodiment, electrodes 502, 504, and 606 may be on one or moreedges of vibration transducer 305, as illustrated in FIG. 6. The areason vibration transducer 305 between electrodes 502 and 606 and/orelectrodes 504 and 606 may vibrate (or provide other haptic outputs)and/or receive pressure input from the user. In an embodiment, insteador in addition to electrode 606 being connected to PCB 314 and held at aconstant voltage (e.g., 0 V), there may be other electrodes connected toPCB 314 and held at a constant voltage (e.g., 0 V).

FIG. 7 is similar to FIGS. 3-6 and shows an electrode 702, configured ina shape to fulfill a design requirement (e.g., an industrial designrequirement). Specifically, electrode 702 is shown in the approximateshape of a finger placed on top of user device 102, permitting asubstantial portion of a user's finger to be detected by vibrationtransducer 305 when the finger is applying pressure to vibrationtransducer 305. Other electrode shapes and locations on vibrationtransducer 305 are contemplated. For example, electrodes may be placedin a manner that permits detection of whether a user is handling device102 (e.g., on the edges of vibration transducer 305).

FIG. 8 is similar to FIGS. 3-7, showing metal plate 317 placed in adifferent position than illustrated in FIG. 3. For example, metal plate317 may be positioned between vibration transducer 305 and PCB 314.Metal plate 317 may have openings 802, 804 through which to passconnections between the leads of antenna 304 and PCB 314.

FIG. 9 is another exploded-view diagram of an exemplary user device 102.Instead of or in addition to metal plate 317, user device 102 maycomprise a metal chassis 902. Metal chassis 902 may function as a frameor support structure (e.g., to provide rigidity). Metal chassis 902 mayfunction as a mount for PCB 314. In some embodiments, user device 102may comprise a non-metal chassis (not shown) instead or in addition tometal chassis 902.

The foregoing description has been presented for purposes ofillustration. It is not exhaustive and is not limited to the preciseforms or embodiments disclosed. Modifications and adaptations of theembodiments will be apparent from consideration of the specification andpractice of the disclosed embodiments. For example, the describedimplementations include hardware and software, but systems and methodsconsistent with the present disclosure can be implemented as hardwarealone.

Computer programs based on the written description and methods of thisspecification are within the skill of a software developer. The variousprograms or program modules can be created using a variety ofprogramming techniques. For example, program sections or program modulescan be designed in or by means of Java™ (seehttps://docs.oracle.com/javase/8/docs/technotes/guides/language/), C,C++, assembly language, or any such programming languages. One or moreof such software sections or modules can be integrated into a computersystem, non-transitory computer-readable media, or existingcommunications software.

Moreover, while illustrative embodiments have been described herein, thescope includes any and all embodiments having equivalent elements,modifications, omissions, combinations (e.g., of aspects across variousembodiments), adaptations or alterations based on the presentdisclosure. The elements in the claims are to be interpreted broadlybased on the language employed in the claims and not limited to examplesdescribed in the present specification or during the prosecution of theapplication. These examples are to be construed as non-exclusive.Further, the steps of the disclosed methods can be modified in anymanner, including by reordering steps or inserting or deleting steps. Itis intended, therefore, that the specification and examples beconsidered as exemplary only, with a true scope and spirit beingindicated by the following claims and their full scope of equivalents.

What is claimed is:
 1. A system providing vibration transduction andradio-frequency communication in proximity to an electrically conductivestructure, the system comprising: an antenna element; an electricallyconductive structure in proximity to the antenna element; and avibration transducer comprising a first material, the first materialcomprising a ferromagnetic material with piezoelectric properties, thevibration transducer being positioned between the antenna element andthe conductive structure, and wherein the vibration transducer comprisesa first portion comprising the first material and a second portioncomprising a second material, the second material being other than aferromagnetic material and being held at a constant voltage.
 2. Thesystem of claim 1, wherein the electrically conductive structurecomprises a substantially flat surface.
 3. The system of claim 1,wherein the electrically conductive structure comprises a metal plate.4. The system of claim 1, wherein the electrically conductive structurecomprises a metal chassis.
 5. The system of claim 1, wherein theelectrically conductive structure comprises a ground plane.
 6. Thesystem of claim 1, wherein the electrically conductive structurecomprises a power plane.
 7. The system of claim 1, wherein theferromagnetic material comprises polyvinylidene difluoride (PVDF). 8.The system of claim 1, wherein the ferromagnetic material comprises amonolithic film.
 9. The system of claim 1, further comprising anelectrical circuit, the electrical circuit comprising a hot electrodecoupled to a first portion of the vibration transducer and aconstant-voltage electrode coupled to a second portion of the vibrationtransducer.
 10. The system of claim 1, further comprising a circuitboard, the circuit board comprising at least one conductive path coupledto the vibration transducer and at least one conductive path coupled tothe antenna element.
 11. The system of claim 1, further comprising anelectronic circuit, wherein a first component of the circuit is coupledto the vibration transducer and a second component of the circuit iscoupled to the antenna element.
 12. The system of claim 1, wherein thevibration transducer converts mechanical stress into an electric signal.13. The system of claim 1, wherein the vibration transducer deforms inresponse to an electrical signal.
 14. The system of claim 1, wherein thevibration transducer generates a haptic output in response to anelectrical signal.
 15. The system of claim 1, wherein the vibrationtransducer generates an audible signal in response to an electricalsignal.
 16. The system of claim 1, wherein the antenna element comprisesa Near-Field Communication antenna.
 17. The system of claim 1, whereinthe distance between the antenna element and the electrically conductivestructure is less than 5 millimeters.
 18. A system providing vibrationtransduction and radio-frequency communication in proximity to anelectrically conductive structure, the system comprising: an antennaelement comprising an inductor; an electrically conductive structure inproximity to the inductor; and a vibration transducer comprising aferromagnetic material with piezoelectric properties, the vibrationtransducer being positioned adjacent to the inductor and between theinductor and the conductive structure, and wherein the vibrationtransducer comprises a first portion comprising a first material and asecond portion comprising a second material, the second material beingother than a ferromagnetic material and being held at a constantvoltage.
 19. A system providing vibration transduction andradio-frequency communication in proximity to an electrically conductivestructure, the system comprising: an antenna element; an electricallyconductive structure in proximity to the antenna element; and avibration transducer comprising a ferromagnetic material withpiezoelectric properties, wherein: the vibration transducer ispositioned between the antenna and the conductive structure, thevibration transducer provides at least one of haptic or auditory outputsignals, the vibration transducer converts at least one of a tactile orauditory input into an electrical signal, and the vibration transducercomprises a first portion comprising a first material and a secondportion comprising a second material, the second material being otherthan a ferromagnetic material and being held at a constant voltage.